In a surprising move, HP and Cisco announced that HP will be reselling a custom-developed Cisco Nexus switch, the “Cisco Nexus B22 Fabric Extender for HP,” commonly called a FEX in Cisco speak. What is surprising about this is that the FEX is a key component of Cisco’s Nexus switch technology as well as an integral component of Cisco’s UCS server product, the introduction of which has pitted the two companies in direct and bitter competition in the heart of HP’s previously sacrosanct server segment. Combined with HP’s increasing focus on networking, the companies have not been the best of buds for the past couple of years. Accordingly, this announcement really makes us sit up and take notice.
So what drove this seeming rapprochement? The coined word “coopetition” lacks the flavor of the German “Realpolitik,” but the essence is the same – both sides profit from accommodating a real demand from customers for Cisco network technology in HP BladeSystem servers. And like the best of deals, both sides walk away thinking that they got the best of the other. HP answers the demands of what is probably a sizable fraction of their customer base for better interoperability with Cisco Nexus-based networks, and in doing so expects to head off customer defections to Cisco UCS servers. Cisco gets both money (the B22 starts at around $10,000 per module and most HP BladeSystem customers who use it will probably buy at least two per enclosure, so making a rough guess at OEM pricing, Cisco is going to make as much as $8,000 to $10,000 per chassis from HP BladeSystems that use the B22) from the sale of the Cisco-branded modules as well as exposure of Cisco technology to HP customers, with the hope that they will consider UCS for future requirements.
I just attended IDF and I’ve got to say, Intel has certainly gotten the cloud message. Almost everything is centered on clouds, from the high-concept keynotes to the presentations on low-level infrastructure, although if you dug deep enough there was content for general old-fashioned data center and I&O professionals. Some highlights:
Chips and processors and low-level hardware
Intel is, after all, a semiconductor foundry, and despite their expertise in design, their true core competitive advantage is their foundry operations – even their competitors grudgingly acknowledge that they can manufacture semiconductors better than anyone else on the planet. As a consequence, showing off new designs and processes is always front and center at IDF, and this year was no exception. Last year it was Sandy Bridge, the 22nm shrink of the 32nm Westmere (although Sandy Bridge also incorporated some significant design improvements). This year it was Ivy Bridge, the 22nm “tick” of the Intel “tick-tock” design cycle. Ivy Bridge is the new 22nm architecture and seems to have inherited Intel’s recent focus on power efficiency, with major improvements beyond the already solid advantages of their 22nm process, including deeper P-States and the ability to actually shut down parts of the chip when it is idle. While they did not discuss the server variants in any detail, the desktop versions will get an entirely new integrated graphics processor which they are obviously hoping will blunt AMD’s resurgence in client systems. On the server side, if I were to guess, I would guess more cores and larger caches, along with increased support for virtualization of I/O beyond what they currently have.
Intel, despite a popular tendency to associate a dominant market position with indifference to competitive threats, has not been sitting still waiting for the ARM server phenomenon to engulf them in a wave of ultra-low-power servers. Intel is fiercely competitive, and it would be silly for any new entrants to assume that Intel will ignore a threat to the heart of a high-growth segment.
In 2009, Intel released a microserver specification for compact low-power servers, and along with competitor AMD, it has been aggressive in driving down the power envelope of its mainstream multicore x86 server products. Recent momentum behind ARM-based servers has heated this potential competition up, however, and Intel has taken the fight deeper into the low-power realm with the recent introduction of the N570, a an existing embedded low-power processor, as a server CPU aimed squarely at emerging ultra-low-power and dense servers. The N570, a dual-core Atom processor, is being currently used by a single server partner, ultra-dense server manufacturer SeaMicro (see Little Servers For Big Applications At Intel Developer Forum), and will allow them to deliver their current 512 Atom cores with half the number of CPU components and some power savings.
Technically, the N570 is a dual-core Atom CPU with 64 bit arithmetic, a differentiator against ARM, and the same 32-bit (4 GB) physical memory limitations as current ARM designs, and it should have a power dissipation of between 8 and 10 watts.
This week at ISSCC, Intel made its first detailed public disclosures about its upcoming “Poulson” next-generation Itanium CPU. While not in any sense complete, the details they did disclose paint a picture of a competent product that will continue to keep the heat on in the high-end UNIX systems market. Highlights include:
Process — Poulson will be produced in a 32 nm process, skipping the intermediate 45 nm step that many observers expected to see as a step down from the current 65 nm Itanium process. This is a plus for Itanium consumers, since it allows for denser circuits and cheaper chips. With an industry record 3.1 billion transistors, Poulson needs all the help it can get keeping size and power down. The new process also promises major improvements in power efficiency.
Cores and cache — Poulson will have 8 cores and 54 MB of on-chip cache, a huge amount, even for a cache-sensitive architecture like Itanium. Poulson will have a 12-issue pipeline instead of the current 6-issue pipeline, promising to extract more performance from existing code without any recompilation.
Compatibility — Poulson is socket- and pin-compatible with the current Itanium 9300 CPU, which will mean that HP can move more quickly into production shipments when it's available.