While the timing of the event comes as a surprise, the fact that IBM has decided to unload its technically excellent but unprofitable semiconductor manufacturing operation does not, nor does its choice of Globalfoundries, with whom it has had a longstanding relationship.
On April 23, IBM rolled out the long-awaited POWER8 CPU, the successor to POWER7+, and given the extensive pre-announcement speculation, the hardware itself was no big surprise (the details are fascinating, but not suitable for this venue), offering an estimated 30 - 50% improvement in application performance over the latest POWER7+, with potential for order of magnitude improvements with selected big data and analytics workloads. While the technology is interesting, we are pretty numb to the “bigger, better, faster” messaging that inevitably accompanies new hardware announcements, and the real impact of this announcement lies in its utility for current AIX users and IBM’s increased focus on Linux and its support of the OpenPOWER initiative.
OK, so we’re numb, but it’s still interesting. POWER8 is an entirely new processor generation implemented in 22 nm CMOS (the same geometry as Intel’s high-end CPUs). The processor features up to 12 cores, each with up to 8 threads, and a focus on not only throughput but high performance per thread and per core for low-thread-count applications. Added to the mix is up to 1 TB of memory per socket, massive PCIe 3 I/O connectivity and Coherent Accelerator Processor Interface (CAPI), IBM’s technology to deliver memory-controller-based access for accelerators and flash memory in POWER systems. CAPI figures prominently in IBM’s positioning of POWER as the ultimate analytics engine, with the announcement profiling the performance of a configuration using 40 TB of CAPI-attached flash for huge in-memory analytics at a fraction of the cost of a non-CAPI configuration.[i]
A Slam-dunk for AIX users and a new play for Linux
As the new year looms, thoughts turn once again to our annual reading of the tea leaves, in this case focused on what I see coming in server land. We’ve just published the full report, Predictions for 2014: Servers & Data Centers, but as teaser, here are a few of the major highlights from the report:
1. Increasing choices in form factor and packaging – I&O pros will have to cope with a proliferation of new form factors, some optimized for dense low-power cloud workloads, some for general purpose legacy IT, and some for horizontal VM clusters (or internal cloud if you prefer). These will continue to appear in an increasing number of variants.
2. ARM – Make or break time is coming, depending on the success of coming 64-bit ARM CPU/SOC designs with full server feature sets including VM support.
3. The beat goes on – Major turn of the great wheel coming for server CPUs in early 2014.
4. Huge potential disruption in flash architecture – Introduction of flash in main memory DIMM slots has the potential to completely disrupt how flash is used in storage tiers, and potentially can break the current storage tiering model, initially physically with the potential to ripple through memory architectures.
Many Indian CIOs and their infrastructure and operations (I&O) teams are in the market for a new data center as their existing data centers are running low on space, power, and cooling capacity. Forrester finds that data growth, virtualization, and consolidation are the main culprits behind these capacity challenges in India. For instance:
Data growth increases data center storage investments. Forrester estimates that storage consumes somewhere between 5% and 15% of the total power consumed in the data center and that the volume of data is growing by 30% to 50% per year.
Virtualization drives higher-density infrastructure architecture. Organizations face pressure to support more extreme compute densities and experiment with new infrastructure architectures.
Data center consolidation puts more pressure on centralized facilities. Per Forrester’s Forrsights Budgets and Priorities Survey, Q4 2012, consolidating IT infrastructure was a critical or high priority for nearly 70% of Indian IT decision-makers. This means more power, cooling, and space for centralized sites.
When I returned to Forrester in mid-2010, one of the first blog posts I wrote was about Oracle’s new roadmap for SPARC and Solaris, catalyzed by numerous client inquiries and other interactions in which Oracle’s real level of commitment to future SPARC hardware was the topic of discussion. In most cases I could describe the customer mood as skeptical at best, and panicked and committed to migration off of SPARC and Solaris at worst. Nonetheless, after some time spent with Oracle management, I expressed my improved confidence in the new hardware team that Oracle had assembled and their new roadmap for SPARC processors after the successive debacles of the UltraSPARC-5 and Rock processors under Sun’s stewardship.
Two and a half years later, it is obvious that Oracle has delivered on its commitments regarding SPARC and is continuing its investments in SPARC CPU and system design as well as its Solaris OS technology. The latest evolution of SPARC technology, the SPARC T5 and the soon-to-be-announced M5, continue the evolution and design practices set forth by Oracle’s Rick Hetherington in 2010 — incremental evolution of a common set of SPARC cores, differentiation by variation of core count, threads and cache as opposed to fundamental architecture, and a reliable multi-year performance progression of cores and system scalability.
Nathan Bedford Forrest, a Confederate general of despicable ideology and consummate tactics, spoke of “keepin up the skeer,” applying continued pressure to opponents to prevent them from regrouping and counterattacking. POWER7+, the most recent version of IBM’s POWER architecture, anticipated as a follow-up to the POWER7 for almost a year, was finally announced this week, and appears to be “keepin up the skeer” in terms of its competitive potential for IBM POWER-based systems. In short, it is a hot piece of technology that will keep existing IBM users happy and should help IBM maintain its impressive momentum in the Unix systems segment.
For the chip heads, the CPU is implemented in a 32 NM process, the same as Intel’s upcoming Poulson, and embodies some interesting evolutions in high-end chip design, including:
Use of DRAM instead of SRAM — IBM has pioneered the use of embedded DRAM (eDRAM) as embedded L3 cache instead of the more standard and faster SRAM. In exchange for the loss of speed, eDRAM requires fewer transistors and lower power, allowing IBM to pack a total of 80 MB (a lot) of shared L3 cache, far more than any other product has ever sported.
Over the last couple of years, IBM, despite having a rich internal technology ecosystem and a number of competitive blade and CI offerings, has not had a comprehensive integrated offering to challenge HP’s CloudSystem Matrix and Cisco’s UCS. This past week IBM effectively silenced its critics and jumped to the head of the CI queue with the announcement of two products, PureFlex and PureApplication, the results of a massive multi-year engineering investment in blade hardware, systems management, networking, and storage integration. Based on a new modular blade architecture and new management architecture, the two products are really more of a continuum of a product defined by the level of software rather than two separate technology offerings.
PureFlex is the base product, consisting of the new hardware (which despite having the same number of blades as the existing HS blade products, is in fact a totally new piece of hardware), which integrates both BNT-based networking as well as a new object-based management architecture which can manage up to four chassis and provide a powerful setoff optimization, installation, and self-diagnostic functions for the hardware and software stack up to and including the OS images and VMs. In addition IBM appears to have integrated the complete suite of Open Fabric Manager and Virtual Fabric for remapping MAC/WWN UIDs and managing VM networking connections, and storage integration via the embedded V7000 storage unit, which serves as both a storage pool and an aggregation point for virtualizing external storage. The laundry list of features and functions is too long to itemize here, but PureFlex, especially with its hypervisor-neutrality and IBM’s Cloud FastStart option, is a complete platform for an enterprise private cloud or a horizontal VM compute farm, however you choose to label a shared VM utility.
Data centers, like any other aspect of real estate, follow the age-old adage of “location, location, location,” and if you want to build one that is really efficient in terms of energy consumption as well as possessing all the basics of reliability, you have to be really picky about ambient temperatures, power availability and, if your business is hosting for others rather than just needing one for yourself, potential expansion. If you want to achieve a seeming impossibility – a zero carbon footprint to satisfy increasingly draconian regulatory pressures – you need to be even pickier. In the end, what you need is:
Low ambient temperature to reduce your power requirements for cooling.
Someplace where you can get cheap “green” energy, and lots of it.
A location with adequate network connectivity, both in terms of latency as well as bandwidth, for global business.
A cooperative regulatory environment in a politically stable venue.
In late 2010 I noted that startup SeaMicro had introduced an ultra-dense server using Intel Atom chips in an innovative fabric-based architecture that allowed them to factor out much of the power overhead from a large multi-CPU server ( http://blogs.forrester.com/richard_fichera/10-09-21-little_servers_big_applications_intel_developer_forum). Along with many observers, I noted that the original SeaMicro server was well-suited to many light-weight edge processing tasks, but that the system would not support more traditional compute-intensive tasks due to the performance of the Atom core. I was, however, quite taken with the basic architecture, which uses a proprietary high-speed (1.28 Tb/s) 3D mesh interconnect to allow the CPU cores to share network, BIOS and disk resources that are normally replicated on a per-server in conventional designs, with commensurate reductions in power and an increase in density.
This week AMD finally released their AMD 6200 and 4200 series CPUs. These are the long-awaited server-oriented Interlagos and Valencia CPUs, based on their new “Bulldozer” core, offering up to 16 x86 cores in a single socket. The announcement was targeted at (drum roll, one guess per customer only) … “The Cloud.” AMD appears to be positioning its new architectures as the platform of choice for cloud-oriented workloads, focusing on highly threaded throughput oriented benchmarks that take full advantage of its high core count and unique floating point architecture, along with what look like excellent throughput per Watt metrics.
At the same time it is pushing the now seemingly mandatory “cloud” message, AMD is not ignoring the meat-and-potatoes enterprise workloads that have been the mainstay of server CPUs sales –virtualization, database, and HPC, where the combination of many cores, excellent memory bandwidth and large memory configurations should yield excellent results. In its competitive comparisons, AMD targets Intel’s 5640 CPU, which it claims represents Intel’s most widely used Xeon CPU, and shows very favorable comparisons in regards to performance, price and power consumption. Among the features that AMD cites as contributing to these results are:
Advanced power and thermal management, including the ability to power off inactive cores contributing to an idle power of less than 4.4W per core. Interlagos offers a unique capability called TDP, which allows I&O groups to set the total power threshold of the CPU in 1W increments to allow fine-grained tailoring of power in the server racks.
Turbo CORE, which allows boosting the clock speed of cores by up to 1 GHz for half the cores or 500 MHz for all the cores, depending on workload.