Only a few months since I authored Forrester’s "Market Overview: Data Center Infrastructure Management Solutions," significant changes merit some additional commentary.
The major vendor drama of the “season” is the continued evolution of Schneider and Emerson’s DCIM product rollout. Since Schneider’s worldwide analyst conference in Paris last week, we now have pretty good visibility into both major vendors' strategy and products. In a nutshell, we have two very large players, both with large installed bases of data center customers, and both selling a vision of an integrated modular DCIM framework. More importantly it appears that both vendors can deliver on this promise. That is the good news. The bad news is that their offerings are highly overlapped, and for most potential customers the choice will be a difficult one. My working theory is that whoever has the largest footprint of equipment will have an advantage, and that a lot depends on the relative execution of their field marketing and sales organizations as both companies rush to turn 1000s of salespeople and partners loose on the world with these products. This will be a classic market share play, with the smart strategy being to sacrifice margin for market share, since DCIM solutions have a high probability of pulling through services, and usually involve some annuity revenue stream from support and update fees.
Earlier this week at its Discover customer event, HP announced a significant set of improvements to its already successful c-Class BladeSystem product line, which, despite continuing competitive pressure from IBM and the entry of Cisco into the market three years ago, still commands approximately 50% of the blade market. The significant components of this announcement fall into four major functional buckets – improved hardware, simplified and expanded storage features, new interconnects and I/O options, and serviceability enhancements. Among the highlights are:
Direct connection of HP 3PAR storage – One of the major drawbacks for block-mode storage with blades has always been the cost of the SAN to connect it to the blade enclosure. With the ability to connect an HP 3PAR storage array directly to the c-Class enclosure without any SAN components, HP has reduced both the cost and the complexity of storage for a wide class of applications that have storage requirements within the scope of a single storage array.
New blades – With this announcement, HP fills in the gaps in their blade portfolio, announcing a new Intel Xeon EN based BL-420 for entry requirements, an upgrade to the BL-465 to support the latest AMD 16-core Interlagos CPU, and the BL-660, a new single-width Xeon E5 based 4-socket blade. In addition, HP has expanded the capacity of the sidecar storage blade to 1.5 TB, enabling an 8-server and 12 TB + chassis configuration.
SugarCRM was kind enough to invite me to its analyst day and conference — a three-day event packed with product, strategy, customer, and partner information. The firm’s focus was clearly on its momentum into the enterprise. Here are my thoughts:
The CRM market still has room to grow. Sugar used IDC’s numbers to project CRM market growth: $18.74 billion for 2012, $19.97 billion for 2013, and $21.37 billion for 2014. Even though CRM vendor solutions are mature, the CRM market has not stagnated.
The SugarCRM 6.5 product. Today, SugarCRM has 1 million users, has seen 11 million downloads, is used by 80,000 organizations, and has 350 partners on five continents supporting the product. Its newest release focuses on usability and performance enhancements. It offers simplified navigation, an enhanced UI design, a new search framework with integrated full-text search, new calendaring and scheduling capabilities, IBM platform support, and deeper integration with third-party apps. Although the product lacks advanced social features and robust analytics, it does provide solid, well-rounded CRM capabilities.
The open source focus. Open source is more than a movement. It provides results by allowing its 30,000-large developer ecosystem to evolve the product in line with customer demand. “Open” is also part of Sugar’s culture — for example, pricing is readily available on its website, and you can try the product for free.
In the latest evolution of its Linux push, IBM has added to its non-x86 Linux server line with the introduction of new dedicated Power 7 rack and blade servers that only run Linux. “Hah!” you say. “Power already runs Linux, and quite well according to IBM.” This is indeed true, but when you look at the price/performance of Linux on standard Power, the picture is not quite as advantageous, with the higher cost of Power servers compared to x86 servers offsetting much if not all of the performance advantage.
Enter the new Flex System p24L (Linux) Compute Node blade for the new PureFlex system and the IBM PowerLinuxTM 7R2 rack server. Both are dedicated Linux-only systems with 2 Power 7 6/8 core, 4 threads/core processors, and are shipped with unlimited licenses for IBM’s PowerVM hypervisor. Most importantly, these systems, in exchange for the limitation that they will run only Linux, are priced competitively with similarly configured x86 systems from major competitors, and IBM is betting on the improvement in performance, shown by IBM-supplied benchmarks, to overcome any resistance to running Linux on a non-x86 system. Note that this is a different proposition than Linux running on an IFL in a zSeries, since the mainframe is usually not the entry for the customer — IBM typically sells to customers with existing mainframe, whereas with Power Linux they will also be attempting to sell to net new customers as well as established accounts.
Over the last couple of years, IBM, despite having a rich internal technology ecosystem and a number of competitive blade and CI offerings, has not had a comprehensive integrated offering to challenge HP’s CloudSystem Matrix and Cisco’s UCS. This past week IBM effectively silenced its critics and jumped to the head of the CI queue with the announcement of two products, PureFlex and PureApplication, the results of a massive multi-year engineering investment in blade hardware, systems management, networking, and storage integration. Based on a new modular blade architecture and new management architecture, the two products are really more of a continuum of a product defined by the level of software rather than two separate technology offerings.
PureFlex is the base product, consisting of the new hardware (which despite having the same number of blades as the existing HS blade products, is in fact a totally new piece of hardware), which integrates both BNT-based networking as well as a new object-based management architecture which can manage up to four chassis and provide a powerful setoff optimization, installation, and self-diagnostic functions for the hardware and software stack up to and including the OS images and VMs. In addition IBM appears to have integrated the complete suite of Open Fabric Manager and Virtual Fabric for remapping MAC/WWN UIDs and managing VM networking connections, and storage integration via the embedded V7000 storage unit, which serves as both a storage pool and an aggregation point for virtualizing external storage. The laundry list of features and functions is too long to itemize here, but PureFlex, especially with its hypervisor-neutrality and IBM’s Cloud FastStart option, is a complete platform for an enterprise private cloud or a horizontal VM compute farm, however you choose to label a shared VM utility.
Next up in the 2012 lineup for the Intel E5 refresh cycle of its infrastructure offerings is Cisco, with its announcement last week of what it refers to as its third generation of fabric computing. Cisco announced a combination of tangible improvements to both the servers and the accompanying fabric components, as well as some commitments for additional hardware and a major enhancement of its UCS Manager software immediately and later in 2012. Highlights include:
New servers – No surprise here, Cisco is upgrading its servers to the new Intel CPU offerings, leading with its high-volume B200 blade server and two C-Series rack-mount servers, one a general-purpose platform and the other targeted at storage-intensive requirements. On paper, the basic components of these servers sound similar to competitors – new E5 COUs, faster I/O, and more memory. In addition to the servers announced for March availability, Cisco stated that it would be delivering additional models for ultra-dense computing and mission-critical enterprise workloads later in the year.
Fabric improvements – Because Cisco has a relatively unique architecture, it also focused on upgrades to the UCS fabric in three areas: server, enclosure, and top-level interconnect. The servers now have an optional improved virtual NIC card with support for up to 128 VLANs per adapter and two 20 GB ports per adapter. One in on the motherboard and another can be plugged in as a mezzanine card, giving up to 80 GB bandwidth to each server. The Fabric Interconnect, the component that connects each enclosure to the top-level Fabric Interconnect, has seen its bandwidth doubled to a maximum of 160 GB. The Fabric Interconnect, the top of the UCS management hierarchy and interface to the rest of the enterprise network, has been up graded to a maximum of 96 universal 10Gb ports (divided between downlinks to the blade enclosures and uplinks to the enterprise fabric.
Today, after two of its largest partners have already announced their systems portfolios that will use it, Intel finally announced one of the worst-kept secrets in the industry: the Xeon E5-2600 family of processors.
OK, now that I’ve got in my jab at the absurdity of the announcement scheduling, let’s look at the thing itself. In a nutshell, these new processors, based on the previous-generation 32 nm production process of the Xeon 5600 series but incorporating the new “Sandy Bridge” architecture, are, in fact, a big deal. They incorporate several architectural innovations and will bring major improvements in power efficiency and performance to servers. Highlights include:
Performance improvements on selected benchmarks of up to 80% above the previous Xeon 5600 CPUs, apparently due to both improved CPU architecture and larger memory capacity (up to 24 DIMMs at 32 GB per DIMM equals a whopping 768 GB capacity for a two-socket, eight-core/socket server).
Improved I/O architecture, including an on-chip PCIe 3 controller and a special mode that allows I/O controllers to write directly to the CPU cache without a round trip to memory — a feature that only a handful of I/O device developers will use, but one that contributes to improved I/O performance and lowers CPU overhead during PCIe I/O.
Significantly improved energy efficiency, with the SPECpower_ssj2008 benchmark showing a 50% improvement in performance per watt over previous models.
Prior to IBM Pulse 2012 heating up in Las Vegas, I was lucky enough to receive a pre-brief on some of the key messages from this year’s event. One of which is around mobility.
A statistic from the IBM mobility slide deck reminded me of a particular bugbear of mine: that mobility will most likely be yet another opportunity for gifted IT professionals to get excited about technology (and managing the technology) rather than stepping back to appreciate that modern IT is all about the consumption of IT services rather than the technology itself. That mobility is not about mobile devices or apps, that it’s about the consumption of business or IT services on the move BY PEOPLE via fit-for-purpose IT provisioning and IT service delivery.
The IBM Statistic?
In a recent IBM report, it was revealed that the Top Mobile Adoption Concerns are:
Cost of developing for multiple mobile platforms (52%)
Integrating cloud services to mobile devices (51%)
Last week it was Dell’s turn to tout its new wares, as it pulled back the curtain on its 12th-eneration servers and associated infrastructure. I’m still digging through all the details, but at first glance it looks like Dell has been listening to a lot of the same customer input as HP, and as a result their messages (and very likely the value delivered) are in many ways similar. Among the highlights of Dell’s messaging are:
Faster provisioning with next-gen agentless intelligent controllers — Dell’s version is iDRAC7, and in conjunction with its LifeCyle Controller firmware, Dell makes many of the same claims as HP, including faster time to provision and maintain new servers, automatic firmware updates, and many fewer administrative steps, resulting in opex savings.
Intelligent storage tiering and aggressive use of flash memory, under the aegis of Dell’s “Fluid Storage” architecture, introduced last year.
A high-profile positioning for its Virtual Network architecture, building on its acquisition of Force10 Networks last year. With HP and now Dell aiming for more of the network budget in the data center, it’s not hard to understand why Cisco was so aggressive in pursuing its piece of the server opportunity — any pretense of civil coexistence in the world of enterprise networks is gone, and the only mutual interest holding the vendors together is their customers’ demand that they continue to play well together.
At its recent financial analyst day, AMD indicated that it intended to differentiate itself by creating products that were advantaged in niche markets, with specific mention, among other segments, of servers, and to generally shake up the trench warfare that has had it on the losing side of its lifelong battle with Intel (my interpretation, not AMD management’s words). Today, at least for the server side of the business AMD made a move that can potentially offer it visibility and differentiation by acquiring innovative server startup SeaMicro.
SeaMicro has attracted our attention since its appearance (blog post 1, blog post 2), with its innovative architecture that dramatically reduces power and improves density by sharing components like I/O adapters, disks, and even BIOS over a proprietary fabric. The irony here is that SeaMicro came to market with a tight alignment with Intel, who at one point even introduced a special dual-core packaging of its Atom CPU to allow SeaMicro to improve its density and power efficiency. Most recently SeaMicro and Intel announced a new model that featured Xeon CPUs to address the more mainstream segments that were not for SeaMicro’s original Atom-based offering.